电子行业常用外贸英文术语外贸关键词表达

做外贸，电子数码产品还有是大行业，无论是B2B 还是B2C 跨境，电子产品都是国外客户的青睐之一，做电子产品外贸的你了解多少行业词汇呢？今天由阿米路路（环球快贸网）www.amilulu.com 社区B2B 小谢给大家分享电子行业常用外贸英文术语外贸关键词表达有用的记得收藏哦

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1号极限开关 LS1(limit suitch 1)

232 bus的使用寿命已到或线路短路或断路 232 bus error

488 bus的使用寿命已到或线路短路或断路 488bus error

5S(整理、整顿、清扫、清洁、修养) 5S（Seiri-Seiton-Seiso-Seiketsu-Shitsuke)

5u之pp质滤心 cartridge p.p 5u

ABC分类法 ABC classification

AUTO模 automatic molding system

A板 A plate

BT指示剂 eriochrome black t indicator

B板 B plate

CO2气泡机 CO2 bubbler

DIP 产品上的裂角任何一方向大于1.25mm且另一方向亦大于0.5mm拒


收 Any device having a chip out greater than 0.5mm in width (or depth) and 1.25mm in length is rejectable.

DIP 从胶体末端算起,支持棒突出部分不得大于0.25mm(SOP为


0.15mm)。 The product is rejectable when pad support protrudes more than 0.25mm from the end of the package body.(sop:0.15mm).





DIP：不符合脚量规之脚弯拒收。


Any device showing bent leads (in case of doubts use the applicable gauge) is rejectable.

DIP：不均匀的镀层表面，使得小脚厚度大于0.4mm或宽度大于0.5mm或大脚以上厚度大于0.75mm，拒收。 Non-uniform solder such that a lead exceeds the dimensions of 0.4mm thick and 0.5mm wide below the seating plate, or an overall thickness of 0.75mm above the seating plane is rejectable.

DIP：从脚尖端到肩膀弯脚处，脚的镀层表面须均匀且连


续。 Lead finish on the leads shall be smooth and continuous from lead tip up to and over bend of lead.

DIP：顶出孔不得高于胶体面或低于胶体表面


0.5mm。 Ejector marks more than above the surface or more than 0.5mm below the surface of the device is rejectable.

DIP：离胶体0.5mm以外之脚表面有浮起、剥落或鳞片状等现象拒


收。 Lifting, peeling or flaking of the lead finish is rejectable excluding 0.5mm from the body.

DIP：小脚上不得有任何外来物造成之沾污。大脚上不得有大于0.15mm直径圆面积之沾


污。 Package leads shall be free from attached foreign material except for foreign material located above the seating plane of the lead, not bigger than 0.15mm in diameter.

DIP：由于冲切造成之支持棒残存凸出或大脚凹陷大于0.25mm拒


收。 Any lead with dam bar step dimensions exceeding 0.25mm is rejectable.

Driver board的使用寿命已到或线路短路或断路 driver board error

EDTA-2NA 标准溶液 EDTA-2NA standard solution

Eprom的使用寿命已到或线路短路或断路 eprom error

KBS 94 混床树脂筒 leasing mix bed resin bottle, kbs 94

L/F存放架 stack loader

L/F放反将导致反弯脚。 Lead frame reverse will cause reverse bending.

L/F排放机 Lead Frame Auto Loader Machine

L/F用剥锡剂 TLS-85a solde stipper for plastic package,TLS-85a





L/F用剥锡剂 TLS-85b solde stipper for plastic package, TLS-85b





L/F用剥锡剂 TLS-86 solder stipper for plastic package,TLS-86

L形尾塞 end plug (L)

L型尾塞 end plug(L)

MPU的使用寿命已到或线路短路或断路 MPU error

N2流量 nitrogen gas flow rate

OC曲线 poprtation curve

P.P 打包袋 P.P Band

PDCA管理循环 PDCA（Plan-Do-Check-Action)

PIN1标示 PIN1 identification

PIN1标示要有且与规格所订的尺寸一


致。 The PIN1 identification must be present and in accordance with the specified dimensions.
PP材质阳极袋 anode bag p.p.
QA允收章 QA mark

QFP用的塑胶承载盘 QFP plastic tray

RAM的使用寿命已到或线路短路或断路 RAM read/write error即RAM error

SOP：不均匀的镀层表面，使得脚的宽度大于0.5mm或脚厚度大于0.25mm。 Non-uniform lead finish such that a lead exceeds the specified dimensions 0.5mm or leadl thickness exceeds 0.25mm is rejectable.

SOP：产品边缘上的裂角宽或深大于0.2mm，长大于0.6mm或露出体材料拒


收。 Any devices having a chip out greater than 0.2mm width(or depth) and 0.6mm in length or exposed lead frame material is rejectable.

SOP：顶出孔低于胶体表面0.2mm，或是高于胶体表面拒


收。 Ejector marks more than above the surface or more than 0.2mm below the surface of the device is rejectable.
SOP：脚浮不得超过0.1mm。 Lead coplanarity shall be within 0.1mm of one another in the vertical direction.

SOP：脚上不得有任何外务物之沾污，但如果是废胶则不能大于50％脚宽为直径的圆面


积。 Leads shall be free attached foreign material, flash shall not exceed 50% of the lead surface.
SOP：离胶体0.2mm以外之脚表面有浮起、剥落或鳞片状等现象拒


收。 Lifting, peeling or flaking of the lead finish is rejectable excluding 0.2mm of the lead length from body.
SOP：由于冲切造成之支持棒残存凸出或凹陷大于0.1mm时拒收。 Any lead with dam bar step dimensions exceeding 0.1mm is rejectable.
S形尾塞 end plug (S)
XX部门经理 manager of XX department
XX电子有限公司 XX Electronics CO.Ltd
X管率 X-ray yield
X射线 X-ray
X-射线检验 X-ray inspection
安全光幕 safety curtain
安全库存量 safety stock
安全眼镜 safety glasses
氨水 ammoniam water
按下紧急按钮。 Press the emergency button.
按需订货 lot for lot
昂球 lifted bond
昂楔 lifted wedge
凹模 cavity plate,cavity block
百万分之一 PPM (parts per million)
柏拉图 Pareto chart
板状模组模具 plate mold
半导体 semiconductor
半球 insufficient ball size
半自动框架输送机 off loader
包反 wrong orentation molding
包反 wrong orientation molding
包封 molding
包封 molding
包封模具 mold chase
包封模具 mold chase
包封偏差 molding mismatch
包装 packing
包装 packing
包装盒(内箱) packing box
包装盒缺点 packing defect criteria
包装外箱 shipping box
保管费 carrying cost
保管费率 carrying cost rate
保险期 safety time
保压时间 holdup time
保证进气通畅，散热可靠 guarantee air inlet open, reliable heat
保质期 shelf life
报废 scrap
备注 remark
背金/银 backside metal (Au/Ag)
背面 back side
背面打印 back marking
崩角 chip package
崩碎 chips
比重 specific gravity
比重 specific gravity
比重计 hydrometer
闭环物料需求计划 closed loop MRP
闭模时间 closing time
边筋翘起 bending side rail
边晶 edge die
边晶 reject die around slice edge
边框 side rail
边沿芯片 edge die
编带 Tape & Reel
编带 tape/real
编带拉力测试 peel back force test
编织层 braid
扁平电缆 flat cable,ribbon cable
扁球 flat ball
变差 variation
变色 discoloration
变色（发黄，发黑，发花，水渍，酸斑） discolor(yellowish,blcken,water mark)
变色、氧化、浮起 discoloration/oxidation/lifting
变形 deformed
变形 deformed/distort
标杆瞄准 benchmarking
标签 label
标签、封装、QA允收章 defect criteria labelled boxes/seal/QA mark
标签内容错误 wrong contents on label
标签内容与内盒产品不符合 contents of label do not correspond with contents of box
标签位置不对、标签贴反 wrong location/orientation of label
标准 criteria
标准操作程序（作业指导书） SOP（Standard Operating Procedure）
标准产品成本 standard product cost
标准单位运转工时 standard unit run hour
标准工资率 standard wage rate
标准机器设置工时 standard set up hour
表面安装 surface mounting
表面粗糙 dull finish / rough surface
表面贴装式 surface mount technology(SMT)
表面污染 surface contamination
别忘了在不良产品上作记号 Don't forget to mark at NG products.
冰箱 refrigerator
冰柱状 icicle
丙酮 acetone
饼夹 Pellet Tong
波峰焊 wave soldering
玻璃棒 glass rod
玻璃胶 glass (epoxy for glass)
玻璃转换温度 grass transition temperature
薄膜气泡 tape bubbles
薄片，锯齿状 flake
补焊 rebonding
补零 remanence fill
补足欠交 fill backorder
不得有任何金属层腐蚀 Ａny metallization corrosion is rejectable
不合格 ninconformity
不合格品 ninconformance
不活动报告 no action report
不良品 reject unit (RJ)
不良数管制图 P N chart
不相同盖印 different marking
不粘 Non-Stick
不正确的周期码 incorrect date code
布线错误 wrong bonding
步骤 process/step
部分盖印 partial marking
擦痕 scratches
擦伤 scratches
擦锡 solder scrape
材料 material
材料清单 BOM（bill of material）
财务部 financial department(FD)
采购订单跟踪 purchase order tracking
采购订单价格 price purchase order
采购计划法 vendor scheduling
采购计划员 vendor scheduler
采购员 buyer
参数 parameter
残料率 scrap factor
残渣、废屑 residues
仓库库位类型 inventoty location type
仓位备注 location remarks
仓位代码 location code
仓位数量 quantity at location
仓位状况 location status
操作规程（操作说明书/操作手册） operation manual
操作员 operator
测试 test
测试机诊断 test diagnostic
层 level
层流台 lamina flow
插孔 socket contact
查找和确认根本原因 Define & Verify Root Cause
差色剂 colorant
产量 through put
产品 product
产品（封装体） package
产品长度 packqge length
产品结构树 production tree
产品控制 product control
产品宽度 package width
产品率 production rate
产品设计 package design
产品特殊特性 special product characteristic
产品外形测量 measure for package out-line
产品线 production line
产品在管中 products in tubes
产品在管中方向错误 wrong orientation of products in tube
产品质量先期策划和控制计划APQP advanced product quality planning and control plan
厂际需求 interplant demand
超波膜 UV tape
超声波清洗机 ultrasonic clearing machine
超音波功率 bond power
超音波清洗 F/S finesonic clean
车床 engine lathc
车间作业管理 shop floor control
尘粒 particle
尘粒计数器 particle counter
尘流台 laminar flow
冲歪率 wire sweep rate
冲弯率 wire deflection rate
冲压车间 stamp workshop,press workshop
冲压模具 die
冲压速度 injection setting
冲圆 fan out
纯水 deionized water (DI water)
纯铜散热片 Copper Heat Sink
次品率 yield lost
次要缺点 minor defect
次要缺陷 minor failure
打包带太松 P.P Band too loosen
打包机 packing machine
打不粘 Non-stick
打次 defect
打火棒 E.F.O.touch
打线速度 bonding speed
打线图 bond diagram
打印 marking
打印 marking
弹坑 crater
弹匣 cassette/magazine
氮气柜 N2 cabinet
刀痕毛刺 kerf chipping
刀片 punch
刀片 punch
导电性 conductive
导电桌垫 conductive table mat
导轨（流道） workholder
导套 bushing
导线 wire
导柱 guide pin
导柱 post
导柱（标杆） post
第1脚记号 pin 1 dot
第二点球焊功率 2nd bond power
第二点球焊时间 2nd bond time
第二点球焊压力 2nd bond force
第二点脱落 second bond peel off
第一点球焊功率 1st bond power
第一点球焊时间 1st bond time
第一点球焊压力 1st bond force
第一点虚焊 1st bond non-stick
第一只脚 pin 1 indicator
点火器 spark gun
点浇口 pin-point gate
点胶 die coating
点胶步骤 procedure for chip coating
点胶机 chip coating machine
点胶缺点 chip coating defect
点胶污染 Dimensions contamination.
点胶一般缺点 Chip coating general defect.